Nikkei Business Publications(BP) previously conducted a teardown analysis of the Chinese electric vehicle BYD Seal, in collaboration with Masayoshi Yamamoto, focusing on its power converters such as the inverter and the DC-DC converter. The findings presented by Yamamoto were based on the results of this teardown.
The teardown revealed that the power modules, equipped with power semiconductor components, were manufactured by BYD. These power modules bear a striking resemblance to the “HybridPACK Drive” power modules produced by Infineon Technologies, a leading German semiconductor manufacturer. It is suggested that BYD’s modules could potentially match or even surpass the performance of Infineon’s.
Infineon is the world’s largest power semiconductor company, and its HybridPACK Drive modules are extensively used in the automotive industry. Since its release in 2017, the HybridPACK Drive has shipped over one million units by May 2021. This indicates that BYD has developed the capability to produce power modules that compete with those from a top industry player.
Predicting BYD’s future in self-research and development, considering their demonstrated ability to produce high-quality power modules in-house, it is likely that BYD will continue to invest in R&D to further enhance their technological capabilities. BYD’s apparent success in creating products comparable to the industry leader suggests a strong potential for the company to become a formidable force in the power semiconductor space. As the electric vehicle market grows, BYD’s commitment to self-research and development could well position them as a key player in the global automotive supply chain, competing with established semiconductor giants and possibly leading to innovations in electric vehicle technology.